Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1995-11-02
1997-11-04
Nguyen, Nam
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429803, 20429819, 20429823, 20429835, C23C 1434
Patent
active
056835612
ABSTRACT:
An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through said chambers of said apparatus at varying rates of speed such that the rate of speed of a pallet from said input end to said output end is a constant for each of said plurality of pallets. A high throughput sputtering apparatus having a plurality of integrally matched components in accordance with the present invention may further include means for transporting a plurality of substrates through said sputtering chambers at variable velocities; means for reducing the ambient pressure within said sputtering chambers to a vacuum level within a pressure range sufficient to enable sputtering operation; means for heating said plurality of substrates to a temperature conducive to sputtering said coatings thereon, said means for heating providing a substantially uniform temperature profile over the surface of said substrates; and control means for providing control signals to and for receiving feedback input from, said sputtering chambers, means for transporting, means for reducing, and means for heating, said control means being programmable for allowing control over said means for sputtering, means for transporting, means for reducing and means for heating.
REFERENCES:
patent: 3294670 (1966-12-01), Charschan et al.
patent: 3787312 (1974-01-01), Wagner et al.
patent: 3852181 (1974-12-01), Cirkler et al.
patent: 4500407 (1985-02-01), Boys et al.
patent: 4558388 (1985-12-01), Graves, Jr.
patent: 4663009 (1987-05-01), Bloomquist et al.
patent: 4700315 (1987-10-01), Blackburn et al.
patent: 4701251 (1987-10-01), Beardow
patent: 4749465 (1988-06-01), Flint et al.
patent: 4880514 (1989-11-01), Scott et al.
patent: 4894133 (1990-01-01), Hedgcoth
patent: 5037515 (1991-08-01), Tsai et al.
Product Brochure for the Leybold AG Model ZV 1200, entitled "ZV 1200 In-Line System for Sputtering Magnetic Data Storage Media", Leybold AG Industrial Coating, Feb. 11, 1991.
Bonigut Josef
Hollars Dennis R.
Lee Kenneth
Payne Gary L.
Pearce David B.
Conner Peripherals, Inc.
Nguyen Nam
LandOfFree
Apparatus and method for high throughput sputtering does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for high throughput sputtering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for high throughput sputtering will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1830147