Apparatus and method for high-accuracy alignment

Radiant energy – Means to align or position an object relative to a source or...

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250306, G21K 510

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active

053171411

ABSTRACT:
A method of alignment of a first object with a second object includes the steps of determining the location of a feature on a surface of the second object using a probe of a scanned probe microscope, and positioning the first object in preselected spatial relationship with respect to the located feature. In an apparatus for performing lithography on a substrate, having a mask and a mask holder supporting the mask, an improvement includes an apparatus having a probe of a scanned probe microscope, for determining the location of a feature on a surface of the substrate. A method of forming a probe of a scanned probe microscope on a substrate includes the steps of providing a conductive base, having a tungsten surface layer, on the substrate, providing a dielectric layer and a high-temperature polymeric layer on the conductive base; opening a hole through the dielectric layer and the organic compound layer to the tungsten surface layer of the base, and selectively depositing tungsten by chemical vapor deposition on the tungsten surface in the hole to form a substantially conical tungsten tip in the hole.

REFERENCES:
patent: 4785187 (1988-11-01), Kariya et al.
patent: 4912822 (1990-04-01), Zdeblick et al.
patent: 5150392 (1992-09-01), Hohn et al.
Hansma, et al., Scanning Tunneling Microscopy and Atomic Force Microscopy Application to Biology and Technology, Science, vol. 242, Oct. 14, 1989, p. 209.
Albrecht, et al., Atomic Resolution with the Atomic Force Microscope on Conductors and Semiconductors, Journal of Vacuum Science & Technology A6:271 (Mar./Apr. 1988).
Heinzelmann, et al., Atomic Force Microscopy: General Aspects and Application to Insulators, Journal of Vacuum Science & Technology A 6:275 (Mar./Apr. 1988).

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