Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2010-09-13
2011-12-20
Robinson, Daniel L (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C118S724000
Reexamination Certificate
active
08080765
ABSTRACT:
A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.
REFERENCES:
patent: 5374382 (1994-12-01), Nishiwaki et al.
patent: 6172337 (2001-01-01), Johnsgard et al.
patent: 6297480 (2001-10-01), Liu et al.
patent: 6322631 (2001-11-01), Okase
patent: 6403925 (2002-06-01), Johnsgard et al.
patent: 6786974 (2004-09-01), Komiya et al.
patent: 7432476 (2008-10-01), Morita et al.
patent: 2003/0186517 (2003-10-01), Takagi
patent: 2003/0222072 (2003-12-01), Leavitt et al.
patent: 2004/0163599 (2004-08-01), Hayashide et al.
patent: 01-241124 (1989-09-01), None
patent: 4-147612 (1992-05-01), None
patent: 8-45817 (1996-02-01), None
patent: 08-045817 (1996-02-01), None
patent: 2000-21733 (2000-01-01), None
patent: 2000-124106 (2000-04-01), None
patent: 2001-244271 (2001-09-01), None
patent: 2002-203778 (2002-07-01), None
patent: 2002-246305 (2002-08-01), None
patent: 2005-45249 (2005-02-01), None
Japanese Office Action issued Oct. 14, 2009 for Japanese Application No. 2005-121267 w/ English language translation.
“Regarding duty to disclose information to the USPTO” dated Jul. 26, 2010 (4 pages).
Fukuoka Tetsuo
Hayashi Shin'ichi
Inadomi Hiroaki
Oda Tetsuya
Robinson Daniel L
Smith , Gambrell & Russell, LLP
Tokyo Electron Limited
LandOfFree
Apparatus and method for heating substrate and coating and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for heating substrate and coating and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for heating substrate and coating and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4270529