Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-08-17
2010-10-12
Robinson, Daniel (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C118S724000
Reexamination Certificate
active
07812285
ABSTRACT:
A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.
REFERENCES:
patent: 5374382 (1994-12-01), Nishiwaki et al.
patent: 6322631 (2001-11-01), Okase
patent: 6786974 (2004-09-01), Komiya et al.
patent: 7432476 (2008-10-01), Morita et al.
patent: 2003/0186517 (2003-10-01), Takagi
patent: 2004/0163599 (2004-08-01), Hayashide et al.
patent: 01-241124 (1989-09-01), None
patent: 4-147612 (1992-05-01), None
patent: 8-45817 (1996-02-01), None
patent: 08-045817 (1996-02-01), None
patent: 2000-21733 (2000-01-01), None
patent: 2002-246305 (2002-08-01), None
patent: 2005-45249 (2005-02-01), None
Japanese Office Action issued Oct. 14, 2009 for Japanese Application No. 2005-121267 w/English language translation.
Fukuoka Tetsuo
Hayashi Shin'ichi
Inadomi Hiroaki
Oda Tetsuya
Robinson Daniel
Smith , Gambrell & Russell, LLP
Tokyo Electron Limited
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