Apparatus and method for heating micro-components mounted on...

Electric heating – Heating devices – With heating unit structure

Reexamination Certificate

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Details

C219S534000, C219S209000

Reexamination Certificate

active

06998587

ABSTRACT:
A package for heating a micro-component is disclosed. The package comprises a platform having a resistive heating element integral with the platform. The package further includes a micro-component disposed on the platform.

REFERENCES:
patent: 4259606 (1981-03-01), Vig
patent: 4627533 (1986-12-01), Pollard
patent: 4744246 (1988-05-01), Busta
patent: 5180942 (1993-01-01), Marvin et al.
patent: 5438219 (1995-08-01), Kotzan et al.
patent: 5500628 (1996-03-01), Knecht
patent: 5659270 (1997-08-01), Millen et al.
patent: 5917272 (1999-06-01), Clark et al.
patent: 6274853 (2001-08-01), Watanabe et al.
patent: 6294771 (2001-09-01), Katsuda et al.
patent: 6400388 (2002-06-01), Imai
patent: 6423944 (2002-07-01), Watanabe et al.
patent: 6525755 (2003-02-01), Imai et al.
patent: 6603093 (2003-08-01), Epitaux et al.
“Optima® Laser Diode Application Notes and Glossary,” Optima Precision Inc., Dec. 2, 1998.
“Using Digital Potentiometers in Laser Diode Applications,” Xicor, May 15, 2001.
“Laser Diodes and Laser Diode Controllers,” Tektronix, 2003.
“Basics of Laser Diodes,” Tektronix, 2002.
“Keeping Cool—Thermoelectric Coolers Offer Efficient Solid-State Heat-Management Options,” oeMagazine. Obtained from http://oemagazine.com/fromTheMagazine/mar01/tutorial.html on Jul. 15, 2003.
Intel application titled “Optoelectronic Package Having A Transmission Line Between Electrical Components And Optical Components,” filed Jul. 30, 2002.
Intel application titled “Optoelectronic Modules And Methods Of Manufacturing The Same,” filed Feb. 4, 2003.
Intel application titled Single-Ended/Differential Wired Radio Frequency Interface, filed Jul. 30, 2002.
Intel application titled “A Method And Apparatus For A Backsided And Recessed Optical Package Connection,” filed (unknown).

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