Metal fusion bonding – Process – With disassembling of bonded joint
Patent
1996-06-21
1998-04-07
Bradley, P. Austin
Metal fusion bonding
Process
With disassembling of bonded joint
228230, 228232, 228 201, B23K 1012, B23K 1018
Patent
active
057354502
ABSTRACT:
An apparatus for heating a module mounted on a card includes a heating chamber adapted to receive the card and module, a nozzle adapted to surround the module and provide a flow of heated gas thereover, and a heated support surface for heating a bottom surface of a card immediately underlying the module. The method of removing and replacing a module on a card includes preheating the card and module prior to heating the contact sites to a solder reflow temperature and also preheating a card and a replacement module to an equilibrium temperature prior to increasing the temperature of the contact sites to the reflow temperature. The apparatus and method embodying the present invention effectively addresses the problem of providing a faster heating cycle, and a more even temperature distribution across the contact sites of the module and card.
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"Non-Destructive Semiconductor Chip Bonding and Chip Removal," Murdoch, Francis J., United States Statutory Invention Registration No. H629, published Apr.4, 1989.
Heim Craig Grant
Le Coz Christian Robert
Lewis Russell H.
Adour, Esq. David L.
Bradley P. Austin
International Business Machines - Corporation
Knapp Jeffrey T.
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