Apparatus and method for handling semiconductor wafers

Details Apparatus and method for handling semiconductor wafers Apparatus and method for handling semiconductor wafers

1995-06-07

1997-04-22

Cherry, Johnny D.

Handling: hand and hoist-line implements

Utilizing fluid pressure

Venturi effect

414938, 414941, B25J 1506, B65H 508

Patent

active

056224001

ABSTRACT:
Disclosed is an apparatus and method for modifying standard semiconductor wafer tranfer apparatus and method to permit the standard semiconductor wafer transfer apparatus and method to function with wafers that are extremely thin and flexible and are warped sufficiently out of planar configuration that it is impossible to establish a sufficient vacuum between the lower surface of the wafer and the upper surface of the transfer instrumentality. A positive gaseous medium pressure is applied to the upper surface of the wafer around the periphery thereof to cause those areas that are flexed upwardly to flex downwardly and contact the upper surface of the transfer instrumentality so that a sufficient vacuum can be established between the lower surface of the wafer and the upper surface of the transfer instrumentality to cause the wafer to be firmly secured to the transfer instrumentality to be transferred thereby from one location to another.

REFERENCES:
patent: 2905768 (1959-09-01), Cronquist
patent: 3466079 (1969-09-01), Mammel
patent: 4775281 (1988-10-01), Prentakis
patent: 4858975 (1989-08-01), Ogawa
patent: 4983093 (1991-01-01), Foulke et al.
patent: 5077888 (1992-01-01), Tokisue et al.
patent: 5174021 (1992-12-01), L'Esperance

Affiliated with

Also associated with

Rating

Apparatus and method for handling semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for handling semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for handling semiconductor wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-337960