Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1992-04-06
1993-12-28
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
156381, 156389, 156344, 156305, 156155, 156152, 51235, 29 2501, 279 3, 269 21, B32B 3100, B24B 100, B23B 1300, B25B 1100
Patent
active
052736156
ABSTRACT:
An apparatus (60) which handles fragile semiconductor wafers (21) adhesively mounted to a submount (22) using a high temperature wax is provided. The apparatus (60) includes a vacuum chuck (24) for holding a first surface of the wafer (21) and a solvent chamber (11, 11') for applying solvent to the back surface of the submount (22). The apparatus (60) includes an enclosure (29) for providing an inert gas environment around the solvent chamber (11, 11'), the wafer (21), and the vacuum chuck (24). The apparatus (60) further includes a means for remounting (30) the wafer (21) to a submount (22) using a low temperature wax after the high temperature wax is dissolved. The wafer (21) is then released from the vacuum chuck (24) and the first surface of the wafer (21) is mounted to an adhesive tape (34). Following the mounting, the low temperature wax is dissolved or melted to demount the wafer (21 ) from the submount (22), leaving the wafer (21) securely mounted on the adhesive tape (34) for sawing.
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Howell, William C., "The Direct Demount of Thinned GaAs Wafers to Sawing Tape," Proceedings of the Conference on Gallium Arsenide Manufacturing Technology (Mantech), 1990.
Asetta Paul D.
Gardner Lawrence R.
Norman Michael P.
Barbee Joe E.
Dover Rennie William
Motorola Inc.
Rainwater Charles
Simmons David A.
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