Apparatus and method for generation of microspheres of metals an

Details Apparatus and method for generation of microspheres of metals an Apparatus and method for generation of microspheres of metals an

1996-10-01

1998-09-22

Phasge, Arun S.

Chemistry: electrical and wave energy

Apparatus

Apparatus for electrical

2391022, 239135, 239 4, B05B 100

Patent

active

058109889

ABSTRACT:
Apparatus and methods for making uniformly-sized and predictably-spaced droplets or solid microspheres from high-temperature or other liquids. Liquid droplet generators having electromechanical driving elements are coupled to a power supply to apply pulsed excitation forces through a wall of a delivery tube to a liquid, e.g., a liquid metal, epoxy, or polymer. The excitation forces generated by the driver induce capillary vibrations in the liquid within the delivery tube, which breaks the stream into substantially uniformly-sized liquid droplets shortly after leaving the orifice. Droplets may be produced in a uniformly-spaced series, or individually on demand in response to a single burst of force from the driving element. If solid microspheres are desired, the trajectory of the emitted droplets is determined to permit the solidification prior to catching or collecting the microspheres. Solidification of the spherical drops may be accomplished by freezing, evaporation, or chemical reaction due to heat transfer, material transfer, or chemical reaction as the droplets traverse a controlled environment chamber. To permit collection of the microspheres with controlled material properties and without deforming or otherwise changing either the sphericity or surface quality, the flight path environment is controlled to bring the drops to a very low speed prior to collection of the solidified microspheres.

REFERENCES:
patent: 1932499 (1933-10-01), Woods
patent: 2269528 (1942-01-01), Gallup
patent: 2510574 (1950-06-01), Greenhalgh
patent: 2574357 (1951-11-01), Stammer et al.
patent: 2779623 (1957-01-01), Eisenkraft
patent: 2789008 (1957-04-01), Cronin
patent: 3023171 (1962-02-01), Smith
patent: 3281860 (1966-10-01), Adams et al.
patent: 3298030 (1967-01-01), Lewis et al.
patent: 3683212 (1972-08-01), Zoltan
patent: 3700169 (1972-10-01), Naydan et al.
patent: 3739393 (1973-06-01), Lyon et al.
patent: 3832579 (1974-08-01), Arndt
patent: 3952921 (1976-04-01), Tanner
patent: 3958249 (1976-05-01), DeMaine et al.
patent: 3972474 (1976-08-01), Keur
patent: 4035116 (1977-07-01), O'Brien et al.
patent: 4243995 (1981-01-01), Wright et al.
patent: 4380518 (1983-04-01), Wydro, Sr.
patent: 4406405 (1983-09-01), Marichy
patent: 4418354 (1983-11-01), Perduijn
patent: 4467236 (1984-08-01), Kolm et al.
patent: 4511600 (1985-04-01), Leas
patent: 4523202 (1985-06-01), Gamblin
patent: 4527717 (1985-07-01), Emoto et al.
patent: 4619845 (1986-10-01), Ayers et al.
patent: 4689515 (1987-08-01), Benndorf et al.
patent: 4736704 (1988-04-01), Henninger
patent: 4774037 (1988-09-01), Hendricks
patent: 4795330 (1989-01-01), Noakes et al.
patent: 4818279 (1989-04-01), Chaleat et al.
patent: 4828886 (1989-05-01), Hieber
patent: 4891242 (1990-01-01), Ito et al.
patent: 4925103 (1990-05-01), Muench et al.
patent: 4929400 (1990-05-01), Rembaum et al.
patent: 4935173 (1990-06-01), Huey et al.
patent: 4991287 (1991-02-01), Piatt et al.
patent: 5008582 (1991-04-01), Tanuma et al.
patent: 5103763 (1992-04-01), Goldowsky et al.
patent: 5132248 (1992-07-01), Drummond et al.
patent: 5152457 (1992-10-01), Burwell et al.
patent: 5154347 (1992-10-01), Vijay
patent: 5196667 (1993-03-01), Gammelin
patent: 5229016 (1993-07-01), Hayes et al.
patent: 5248087 (1993-09-01), Dressler
patent: 5266098 (1993-11-01), Chun et al.
patent: 5401445 (1995-03-01), Menchhofer
patent: 5560543 (1996-10-01), Smith et al.
Article Entitled, "Manufacturing Parts, Drop by Drop," Compressed Air Magazine, pp. 38-44, Mar. 1995.
Demonstration Flyer Entitled, "Demonstration--IBM MicroDynamic Solder Pump," IBM Corporation, Austin, Texas, received at Surface Mount Int'l Proceedings in San Jose, CA, Aug. 30-31, 1994.
Hayes et al., "Picoliter Solder Droplet Dispensing," MicroFab Technologies, Inc., ISHM '92, pp. 1-6, Oct. 1992.
Schiesser et al., "Micro Dynamic Solder Pump: Drop on Demand Eutectic Solder Dispensing Device," Proceedings of Surface Mount Int'l, San Jose, CA, pp. 501-509, Aug. 1994.
Teng and Vest, "Metallization of Solar Cells with Ink Jet Printing and Silver Metallo-Organic Inks," IEEE Trans on Components, Hybrids, and Mfg. Technology, 11:291-297, Sep. 1988.
Teng, "Ink Jet Printing inThick Film Hybrid Microelectronics," Dissertation Abstracts Int'l, 48:225-B, Jul. 1987.
Travis, "Making Materials that are Good to the Last Drop," Science, 258:1307, Nov. 1992.
Vest et al., "Ink Jet Printing of Hybrid Circuits," Int. Journal for Hybrid Microelectronics, 6:261-267, 1983.
Wallace, "Automated Electronic Circuit Manufacturing Using Ink-Jet Technology," Journal of Electronic Packaging, 111:108-111, Jun. 1989.

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