Electric heating – Metal heating – Wire – rod – or bar bonding
Patent
1994-06-10
1995-10-31
Shaw, Clifford C.
Electric heating
Metal heating
Wire, rod, or bar bonding
219 5621, 2191305, 21913021, 21913032, B23K 1116
Patent
active
054631971
ABSTRACT:
A ball forming apparatus free from parameter variations introduced in setting spark discharge control parameters wherein the variations may be largely of operator-dependent or apparatus-dependent nature. To control discharge parameters, digital data for controlling discharge are transmitted in serial communications from a wire bonder controller to the ball forming apparatus, and the digital data are used to set parameters such as discharge current, discharge time, heat development and the like. The discharge state data acquired during spark discharge is transmitted in serial communications from the ball forming apparatus to the wire bonder controller so that the above parameters are used for feedback control. Irregularity or difference in the ball size that may vary from apparatus to apparatus is eliminated, and an improved bondability results. Unnecessary bondings are reduced, and an improved manufacturing efficiency in semiconductor field is achieved.
REFERENCES:
patent: 4390771 (1983-06-01), Kurtz et al.
patent: 4707579 (1987-11-01), McKiel, Jr.
patent: 5110032 (1992-05-01), Akiyama et al.
patent: 5212361 (1993-05-01), Miyazaki et al.
patent: 5214259 (1993-05-01), Terakado et al.
Mitsubishi Denki & Kabushiki Kaisha
Shaw Clifford C.
LandOfFree
Apparatus and method for forming wire bonding ball does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for forming wire bonding ball, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for forming wire bonding ball will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1774283