Apparatus and method for forming the external leads of an integr

Details Apparatus and method for forming the external leads of an integr Apparatus and method for forming the external leads of an integr

1997-08-12

1998-09-15

Larson, Lowell A.

Wireworking

Crimping

140147, B21F 4500

Patent

active

058065717

ABSTRACT:
An apparatus and method is provided for forming the external leads of an IC, wherein the coplanarity of the tips of the plurality of external leads after external lead formation can be improved even with an IC in which the resin portion is curved. The apparatus comprises a plurality of resin support projections which each support part of a resin portion from underneath, and a plurality of support pins respectively opposing the resin support projections, which each press on part of the resin portion from above.

REFERENCES:
patent: 4907628 (1990-03-01), Corey et al.
patent: 5078186 (1992-01-01), Togashi et al.
patent: 5477894 (1995-12-01), Wakabayashi et al.

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