Metal fusion bonding – Including means to apply flux or filler to work or applicator
Patent
1997-06-17
1999-02-23
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
228254, 21912165, H01L 2160
Patent
active
058735119
ABSTRACT:
The placement of solder "balls" in a Ball Grid Array is accomplished by placing a solder strip in contact with the top surface of the ball grid array carrier. The pulsing of a laser directed at the solder in discrete positions permits the transfer of the solder to the gold dot, of the array of dots, on the carrier in registry with the laser output when activated. Selective solder placement is possible and increasingly higher throughput is achieved by the use of laser diode bars or optical fiber fans to effect solder transfer to a plurality of dots of the array simultaneously. The entire process can be automated by making the solder strip continuous through a recycling station arranged along a path along which the solder strip moves to the position where the carrier and the solder strip are moved into juxtaposition. The use of a transparent strip with a pattern of holes filled with solder paste permits easy transfer of the solder to the gold dots or islands on the carrier in registry with laser beam.
REFERENCES:
patent: 5153408 (1992-10-01), Handford et al.
patent: 5323947 (1994-06-01), Juskey et al.
patent: 5416969 (1995-05-01), Miura
patent: 5442852 (1995-08-01), Danner
patent: 5565119 (1996-10-01), Behun et al.
Heinrich Samuel M.
Shapiro Herbert M.
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