Apparatus and method for forming mold for metallic material

Details Apparatus and method for forming mold for metallic material Apparatus and method for forming mold for metallic material

1995-11-21

1998-02-17

Ramsey, Kenneth J.

Metal fusion bonding

Solder form

164 47, 22818022, 228253, H01L 2160

Patent

active

057183619

ABSTRACT:
The present invention relates generally to a new apparatus and method for molding metallic materials, such as, for example, solder. More particularly, the invention encompasses an apparatus that is used to form metallic interconnections, such as, for example, solder connections, such as, BGA (Ball Grid Array) or CGA (Column Grid Array) in a mold for later use to electrically or mechanically connect two devices, such as, for example, semiconductor devices. A method for forming the metallic connections that are used to electrically or mechanically connect two devices, such as, for example, semiconductor devices is also disclosed. However, these metallic interconnections in a mold could also be used to form other structures, such as, for example, heat sinks with fins, etc.

REFERENCES:
patent: 4434134 (1984-02-01), Darrow et al.
patent: 4750889 (1988-06-01), Ignasiak et al.
patent: 4914814 (1990-04-01), Behun et al.
patent: 5029748 (1991-07-01), Lauterbach et al.
patent: 5048747 (1991-09-01), Clark et al.
patent: 5244143 (1993-09-01), Ference et al.
patent: 5551148 (1996-09-01), Kazui et al.

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