Patent
1986-11-13
1989-11-07
James, Andrew J.
357 49, 357 51, H01L 2704, H01L 2352
Patent
active
048795879
ABSTRACT:
A fusible link is described. It comprises a semiconductor substrate, an electrically insulating layer on the substrate, a pair of conductor elements on the surface of the insulating layer opposite the substrate, and a fuse conductor layer on the surface of the insulating layer opposite the substrate electrically connecting the conductor elements. A cavity is formed in the insulating layer and the substrate adjacent the fuse conductor layer. The cavity has a configuration to provide a substantial reduction in the thermal conductivity cross-section between the fuse conductor layer and the substrate. Such substantial reduction is selected to enable a predetermined electrical power input to the fuse conductor layer to generate an open circuit in the layer. In a preferred form, the cavity has a configuration to form a bridge comprised of the fuse conductor layer and the portion of the insulating layer upon which the fuse conductor layer is disposed.
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James Andrew J.
Soltz David
Transensory Devices, Inc.
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