Apparatus and method for forming film

Details Apparatus and method for forming film Apparatus and method for forming film

1997-08-11

1999-03-09

Nguyen, Nam

Coating processes

With stretching or tensioning

Running lengths

427171, 4272555, 4272481, 427249, 427536, 427562, 427569, 20429805, 20429824, 118723E, 118718, C23C 1600, C23C 1456

Patent

active

058797416

ABSTRACT:
When a thin film is formed on a flexible and filmy substrate by a vapor phase method, the substrate is prevented from warping to be caused by the internal stress remaining in the thin film. When the thin film is formed by the vapor phase method, the substrate is previously curved so that the stress acts in the direction canceling the internal stress remaining in the thin film to be formed prior to the filming. Accordingly, the stress of the curved substrate cancels out the stress remaining in the thin film formed on the substrate. The substrate having a thin film formed thereon is not warped, the stress in the interface between the thin film formed and the substrate is removed, and the thin film has no cracks to be caused by the stress.

REFERENCES:
patent: 4440107 (1984-04-01), Doehler et al.
patent: 4446816 (1984-05-01), Kitamoto et al.
patent: 4920917 (1990-05-01), Nakatani et al.
patent: 4960072 (1990-10-01), Ohta et al.
patent: 5140938 (1992-08-01), Kananuki et al.

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