Apparatus and method for forming cavity substrates using flexibl

Details Apparatus and method for forming cavity substrates using flexibl Apparatus and method for forming cavity substrates using flexibl

1995-09-29

1998-05-05

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156289, 156323, 156382, 156580, 4254051, 425500, B32B 3500

Patent

active

057468745

ABSTRACT:
The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates using at least one flexible preform insert. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic) substrates using at least one flexible preform insert that is inserted into the cavity of the MLC substrate prior to lamination and this insert helps in preventing the collapse of the shelves of the cavity during this lamination process. After the lamination process the inventive temporary preform insert is then removed.

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