Apparatus and method for forming a combined substrate structure

Geometrical instruments – Gauge – Work support adjustment

Reexamination Certificate

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Details

C033S333000, C033S549000, C382S218000, C382S125000, C382S172000, C445S024000, C445S066000, C438S758000

Reexamination Certificate

active

06848191

ABSTRACT:
An apparatus for supporting a combined substrate structure, comprising first and second substrates combined, includes: level-adjustable supporting mechanisms for supporting plural supporting points of a bottom surface of the combined substrate structure; a level-detecting system for detecting respective levels of corresponding points of a top surface of the combined substrate structure to the plural supporting points of the bottom surface; and a control system for receiving the detected levels from the level-detecting system and for controlling the plurality of level-adjustable supporting mechanism in respective level-adjustment operations in accordance with the detected levels.

REFERENCES:
patent: 6272763 (2001-08-01), Yamaguchi et al.
patent: 6457478 (2002-10-01), Danese
patent: 6631726 (2003-10-01), Kinoshita et al.
patent: 20010035131 (2001-11-01), Sakuma et al.
patent: 20020022379 (2002-02-01), Ashizawa et al.
patent: 20020078580 (2002-06-01), Haugen et al.
patent: 20020086259 (2002-07-01), Shirakawa et al.
patent: 20020123236 (2002-09-01), Tanaka et al.
patent: 20030171057 (2003-09-01), Lee et al.
patent: 20030173032 (2003-09-01), Lee et al.
patent: 9-281513 (1997-10-01), None
patent: 10-104564 (1998-04-01), None
patent: 11-2823 (1999-01-01), None

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