Apparatus and method for fluxless soldering

Details Apparatus and method for fluxless soldering Apparatus and method for fluxless soldering

1994-06-27

1995-12-26

Heinrich, Samuel M.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2282341, 2281241, B23K 100, H01L 2150

Patent

active

054780055

ABSTRACT:
For soldering together two surfaces of a workpiece by means of solder, and without the use of a solder flux, apparatus includes means for preheating the workpiece and solder to a temperature close to but less than the solder fusing temperature, and means for directing two jets of a hot, non-oxidizing gas towards the preform from opposite sides thereof and along a straight line axis. The hot gas melts the solder and causes flow of the melted solder between the two surfaces in directions generally transverse to the axis of the two gas jets.

REFERENCES:
patent: 3603329 (1968-11-01), White et al.
patent: 3653572 (1972-04-01), Dushkes et al.
patent: 5220147 (1993-06-01), Spigarelli et al.
IBM Technical Disclosure Bulletin, "Use of a Heated Gas Jet to Remove a Silicon Chip . . . ", pp. 3725, 3726, vol. 20, No. 9, Feb. 1978.

Affiliated with

Also associated with

Rating

Apparatus and method for fluxless soldering does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for fluxless soldering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for fluxless soldering will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1363420