Apparatus and method for flexible point-to-point soldering

Details Apparatus and method for flexible point-to-point soldering Apparatus and method for flexible point-to-point soldering

1994-08-19

1996-06-11

Walberg, Teresa J.

Electric heating

Metal heating

By arc

21912165, 21912178, 228 45, B23K 2602

Patent

active

055257771

ABSTRACT:
A point-to-point soldering apparatus applies solder to predetermined points on a workpiece in response to control signals from a control circuit. The apparatus includes a heat source moveable to first locations adjacent to the solder points in response to control signals from the control circuit and a solder material source moveable to second locations adjacent to the solder points independently of the heat source in response to control signals from the control circuit. The heat source is mounted on a first robotic positioner and the material source is mounted on a second robotic positioner for independent movement and positioning. A user-programmable controller executes preset soldering routines in which the heat source and material source are positioned adjacent to solder points and commanded to apply heat and solder in accordance with the soldering routines. A code reader may be provided for detecting a code representing the configuration of workpieces to be soldered and the soldering routine to be executed by the controller. A tool wear monitor may be provided for determining the degree of tool wear, whereby the soldering tool is automatically changed when an unacceptable degree of wear is detected. A method for applying solder to points on a workpiece is also presented.

REFERENCES:
patent: 4832246 (1989-05-01), Ono et al.
patent: 4899924 (1990-02-01), Kawaguchi
patent: 4926345 (1990-05-01), Novak et al.
patent: 5052338 (1991-10-01), Maiorca et al.
patent: 5122635 (1992-06-01), Knodler et al.
patent: 5261590 (1993-11-01), Tsai

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