Apparatus and method for flat circuit assembly

Details Apparatus and method for flat circuit assembly Apparatus and method for flat circuit assembly

1994-07-27

1997-02-04

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257535, 257924, 174 521, 361820, H01L 2702

Patent

active

056001754

ABSTRACT:
A thin and flat integrated circuit assembly (10, 40) may be achieved by using a thin carrier (20) with shallow cavities (22, 24) for holding the integrated circuits (16) and/or discrete circuit components (14). The integrated circuits (16) and/or circuit components (14) may be friction fitted in the cavities (22, 24) or they may be secured therein by the use of adhesives and/or solder. Electrical connection between the integrated circuits (16) and circuit components (14) may be done with wire bonding, ribbon bonding, tape-automated bonding, lead frames, flip chip bonding, and/or conductive gluing of leads. The circuit assembly may then be accommodated into a credit card-sized packaging with standard dimensions set by the International Standards Organization.

REFERENCES:
patent: 3539884 (1968-09-01), Schaffner
patent: 4907062 (1990-03-01), Fukushima
patent: 5053774 (1991-10-01), Schuermann et al.

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