Apparatus and method for filling a ball grid array

Details Apparatus and method for filling a ball grid array Apparatus and method for filling a ball grid array

1997-04-04

1999-07-06

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

118213, H01L 2160, B23K 306

Patent

active

059187921

ABSTRACT:
The array of recesses in a ball grid array carrier or (device) are populated with solder balls through a closely spaced tooling plate or stencil which has a like array of apertures. A solder bin is moved along side rails over the stencil allowing solder balls to fill the apertures in the stencil settling on the corresponding recesses and held there by adhesive. Excess solder balls are moved along by the movement of the bin. The bin is held in close contact with the stencil to avoid misplacement of the balls by bowing the stencil and by forcing it into a plane coplanar with the bottom of the bin. Alternative techniques are magnetic or vacuum areas of the bottom of the bin to ensure complete contact with the stencil.

REFERENCES:
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5454159 (1995-10-01), Norell
patent: 5620927 (1997-04-01), Lee
patent: 5655704 (1997-08-01), Sakessi et al.
patent: 5704536 (1998-01-01), Chen et al.

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