Apparatus and method for feeding slurry

Abrading – Machine – Sandblast

Reexamination Certificate

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C451S060000

Reexamination Certificate

active

10865822

ABSTRACT:
A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.

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Notice of Reasons of Rejection, Patent Application No. 10-332634, Mailing Date: Jul. 30, 2002, Mailing No. 247483.
Office Action issued by Japanese Patent Office dated Jan. 23, 2007 in corresponding Japanese Application No. 2003-378411.
Office Action issued by Japanese Patent Office dated Jan. 23, 2007 in corresponding Japanese Application No. 2003-378417.

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