Apparatus and method for facilitating pumped...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S727000, C165S080400, C165S080500, C165S104330, C174S015100, C174S0170LF, C062S259200, C257S714000

Reexamination Certificate

active

07983040

ABSTRACT:
Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container. The apparatus further includes a coolant pump assembly coupled in fluid communication with the coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant is pumped through the container, the multiple different types of components of the electronic subsystem are immersion-cooled by the coolant. In one embodiment, a filler element is disposed within the container, and is sized to reduce the amount of coolant within the container, while still maintaining the components of the electronic subsystem immersion-cooled.

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