Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-17
2010-02-09
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679460, C361S679500, C361S679530, C361S695000, C361S696000, C361S698000, C361S700000, C361S701000, C165S080500, C165S104330, C062S259200
Reexamination Certificate
active
07660109
ABSTRACT:
Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.
REFERENCES:
patent: 4011905 (1977-03-01), Millard
patent: 5056331 (1991-10-01), Lotz
patent: 5069273 (1991-12-01), O'Hearne
patent: 5467250 (1995-11-01), Howard et al.
patent: 5706668 (1998-01-01), Hilpert
patent: 5896922 (1999-04-01), Chrysler et al.
patent: 6164369 (2000-12-01), Stoller
patent: 6205796 (2001-03-01), Chu et al.
patent: 6279337 (2001-08-01), Davidson et al.
patent: 6345512 (2002-02-01), Cosley et al.
patent: 6374627 (2002-04-01), Schumacher et al.
patent: 6462944 (2002-10-01), Lin
patent: 6535382 (2003-03-01), Bishop et al.
patent: 6574104 (2003-06-01), Patel et al.
patent: 6745579 (2004-06-01), Spinazzola et al.
patent: 6746212 (2004-06-01), Payne
patent: 6747872 (2004-06-01), Patel et al.
patent: 6760221 (2004-07-01), Goth et al.
patent: 6775137 (2004-08-01), Chu et al.
patent: 6819563 (2004-11-01), Chu et al.
patent: 6826922 (2004-12-01), Patel et al.
patent: 6867967 (2005-03-01), Mok
patent: 6896612 (2005-05-01), Novotny
patent: 6924981 (2005-08-01), Chu et al.
patent: 7086247 (2006-08-01), Campbell et al.
patent: 7104081 (2006-09-01), Chu et al.
patent: 7120021 (2006-10-01), Hamman
patent: 7203063 (2007-04-01), Bash et al.
patent: 7236359 (2007-06-01), Strobel
patent: 7315448 (2008-01-01), Bash et al.
patent: 2004/0177948 (2004-09-01), Cho et al.
patent: 2004/0231913 (2004-11-01), McCombs et al.
patent: 2005/0217299 (2005-10-01), Chu et al.
patent: 2005/0225936 (2005-10-01), Day
patent: 2005/0237716 (2005-10-01), Chu et al.
patent: 2006/0126296 (2006-06-01), Campbell et al.
patent: 2006/0232945 (2006-10-01), Chu et al.
patent: 2006/0250770 (2006-11-01), Campbell et al.
patent: 2007/0019380 (2007-01-01), Campbell et al.
patent: 2007/0044493 (2007-03-01), Kearney et al.
patent: 2008/0060371 (2008-03-01), Jude
patent: 2009/0080173 (2009-03-01), Porter et al.
“Rack Cooler—A Cool Solution for X-Treme Density Rack Enclosure Systems”, Liebert Corporation, Product Brochure, 8 pgs. (2001).
Teague, Paul E., “One Cool Machine”, Design News for Mechanical and Design Engineers, Internet Article, 6 pgs. (Feb. 7, 2005).
Campbell et al., “Coolant Control Unit, and Cooled Electronics System and Method Employing the Same”, U.S. Appl. No. 11/427,465, filed Jun. 29, 2006.
Campbell et al., “Cooled Electronics System and Method Employing Air-to-Liquid Heat Exchange and Bifurcated Air Flow”, U.S. Appl. No. 11/467,245, filed Aug. 25, 2006.
Campbell et al., “Methods for Configuring Tubing for Interconnecting In-Series Multiple Liquid-Cooled Cold Plates”, U.S. Appl. No. 11/620,088, filed Jan. 5, 2007.
Campbell et al., “System and Method of Facilitating Cooling of Electronics Racks of a Data Center Employing Multiple Cooling Stations”, U.S. Appl. No. 11/744,269, filed May 4, 2007.
Porter et al., “Vapor-Compression Heat Exchange System with Evaporator Coil Mounted to Outlet Door Cover of an Electronics Rack”, U.S. Appl. No. 11/860,634, filed Sep. 25, 2007.
Campbell et al., “Docking Station with Hybrid Air and Liquid Cooling of an Electronics Rack”, U.S. Appl. No. 11/862,346, filed Sep. 27, 2007.
Iyengar et al., “Apparatus for Facilitating Cooling of an Electronics Rack Through the Use of an Air-to-Liquid Heat Exchanger”, U.S. Appl. No. 11/939,650, filed Nov. 14, 2007.
Iyengar Madhusudan K.
Kamath Vinod
Matteson Jason A.
Schmidt Roger R.
Steinke Mark E.
Gandhi Jayprakash N
Heslin Rothenberg Farley & & Mesiti P.C.
Hoffberg Robert J
International Business Machines - Corporation
Monteleone, Esq. Geraldine
LandOfFree
Apparatus and method for facilitating cooling of an... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for facilitating cooling of an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for facilitating cooling of an... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4173768