Apparatus and method for fabricating bonded substrate

Details Apparatus and method for fabricating bonded substrate Apparatus and method for fabricating bonded substrate

2005-10-21

2009-10-06

Crispino, Richard (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S286000, C156S381000, C156S382000, C269S021000, C347S187000

Reexamination Certificate

active

07597774

ABSTRACT:
A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

REFERENCES:
patent: 4424092 (1984-01-01), Salenz
patent: 4808059 (1989-02-01), Eddy
patent: 5407519 (1995-04-01), Joffe et al.
patent: 5564682 (1996-10-01), Tsuji
patent: 5645474 (1997-07-01), Kubo et al.
patent: 5706843 (1998-01-01), Matsuo
patent: 5707051 (1998-01-01), Tsuji
patent: 5741558 (1998-04-01), Otani et al.
patent: 5766671 (1998-06-01), Matsui
patent: 5902678 (1999-05-01), Konda et al.
patent: 5989346 (1999-11-01), Hiroki
patent: 6022185 (2000-02-01), Mokuo
patent: 6222603 (2001-04-01), Sakai et al.
patent: 6231706 (2001-05-01), Higaki et al.
patent: 6254716 (2001-07-01), Russel et al.
patent: 6328838 (2001-12-01), Wirth et al.
patent: 6646689 (2003-11-01), Matsuda
patent: 6793756 (2004-09-01), Lee et al.
patent: 6798488 (2004-09-01), Murata et al.
patent: 6829032 (2004-12-01), Lee et al.
patent: 6953073 (2005-10-01), Lee et al.
patent: 6991699 (2006-01-01), Lee et al.
patent: 7096911 (2006-08-01), Hashizume et al.
patent: 7354494 (2008-04-01), Miyajima et al.
patent: 2002/0062787 (2002-05-01), Hashizume et al.
patent: 2004/0149379 (2004-08-01), Kobayashi et al.
patent: 2006/0027318 (2006-02-01), Hashizume et al.
patent: 2006/0037707 (2006-02-01), Muramoto et al.
patent: 2006/0048896 (2006-03-01), Muramoto et al.
patent: 2007/0034332 (2007-02-01), Muramoto et al.
patent: 62-211245 (1987-09-01), None
patent: 01-214042 (1989-08-01), None
patent: 05-190414 (1993-07-01), None
patent: 6-69315 (1994-03-01), None
patent: 07-058191 (1995-03-01), None
patent: 08-236597 (1996-09-01), None
patent: 08-316288 (1996-11-01), None
patent: 9-243982 (1997-09-01), None
patent: 9-246352 (1997-09-01), None
patent: 9-266242 (1997-10-01), None
patent: 11-262828 (1999-09-01), None
patent: 2000-82732 (2000-03-01), None
patent: 2000-258746 (2000-09-01), None
patent: 2000-284295 (2000-10-01), None
patent: 2001-085494 (2001-03-01), None
patent: 2001-087719 (2001-04-01), None
patent: 2001-282126 (2001-10-01), None
patent: 2001-356353 (2001-12-01), None
patent: 2002-040398 (2002-02-01), None
patent: 2003-137616 (2003-05-01), None
patent: 2003-241202 (2003-08-01), None
patent: 10-0272186 (1994-03-01), None
patent: 1998-041650 (1998-08-01), None
patent: 10-0272186 (2000-08-01), None
patent: 10-2001-0038101 (2001-05-01), None
patent: WO 00/11527 (2000-03-01), None
U.S. Appl. No. 10/347,625, filed Sep. 22, 2003, Takanori Muramoto et al., Fujitsu Limited.
Japanese Office Action for corresponding application 2006-082407 mailed on Jan. 29, 2008.
Japanese Office Action for corresponding application 2005-371994 mailed on Jan. 29, 2008.
Japanese Office Action for corresponding application 2005-371993 mailed on Jan. 29, 2008.
Chinese Patent Office Action, mailed Oct. 19, 2007 and issued in corresponding Chinese Patent Application No. 200610099809.X.
Chinese Patent Office Action, mailed Oct. 19, 2007 and issued in corresponding Chinese Patent Application No. 200610099808.5.
English language Abstract of Korean Patent Publication No. 2001-0020690.
U.S. Appl. No. 10/347,625, filed Jan. 22, 2003, Takanori Muramoto et al., Fujitsu Limited.
U.S. Appl. No. 11/254,712, filed Oct. 21, 2005, Takanori Muramoto et al., Fujitsu Limited.
U.S. Appl. No. 11/254,741, filed Oct. 21, 2005, Takanori Muramoto et al., Fujitsu Limited.
U.S. Appl. No. 11/580,908, filed Oct. 16, 2006, Takanori Muramoto et al., Fujitsu Limited.
Korean Patent Office Action, mailed Aug. 1, 2007 and issued in related Korean Patent Application No. 10-2006-0040807.
Korean Patent Office Action, mailed Aug. 1, 2007 and issued in related Korean Patent Application No. 10-2006-0040806.
Korean Patent Office Action, mailed Aug. 1, 2007 and issued in related Korean Patent Application No. 10-2006-0040801.
Chinese Patent Office Action, mailed Nov. 2, 2007 and issued in corresponding Chinese Patent Application No. 200610099807.0.
Chinese Patent Office Action, mailed Nov. 2, 2007 and issued in corresponding Chinese Patent Application No. 200610099803.2.
U. S. Office Action issued on Nov. 23, 2007 for co-pending U.S. Appl. No. 11/254,712, filed Oct. 21, 2005.
U.S. Office Action issued on Nov. 23, 2007 for co-pending U.S. Appl. No. 11/254,741, filed Oct. 21, 2005.
Korean Office Action for corresponding Korean application 10-2008-0100401; dated Nov. 13, 2008.
Office Action for corresponding U.S. Appl. No. 11/254,741; mailed on Mar. 18, 2009.

Affiliated with

Also associated with

Rating

Apparatus and method for fabricating bonded substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for fabricating bonded substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for fabricating bonded substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4141528