Apparatus and method for fabricating bonded substrate

Details Apparatus and method for fabricating bonded substrate Apparatus and method for fabricating bonded substrate

2006-11-21

2006-11-21

Crispino, Richard (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

C414S796600, C414S797000, C414S222010

Reexamination Certificate

active

07137427

ABSTRACT:
Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

REFERENCES:
patent: 4424092 (1984-01-01), Salenz
patent: 4808059 (1989-02-01), Eddy
patent: 5407519 (1995-04-01), Joffe et al.
patent: 5645474 (1997-07-01), Kubo et al.
patent: 5741558 (1998-04-01), Otani et al.
patent: 5766671 (1998-06-01), Matsui
patent: 5902678 (1999-05-01), Konda et al.
patent: 6231706 (2001-05-01), Higaki et al.
patent: 6829032 (2004-12-01), Lee et al.
patent: 2000-258746 (2000-09-01), None
patent: 2000-284295 (2000-10-01), None
patent: 2001-087719 (2001-04-01), None
patent: WO 00/11527 (2000-03-01), None

Affiliated with

Also associated with

Rating

Apparatus and method for fabricating bonded substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for fabricating bonded substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for fabricating bonded substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3692591