Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Chamber enclosing work during bonding and/or assembly
Reexamination Certificate
2011-06-21
2011-06-21
Crispino, Richard (Department: 1747)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Chamber enclosing work during bonding and/or assembly
C156S580000, C156S581000, C269S021000
Reexamination Certificate
active
07963308
ABSTRACT:
A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
REFERENCES:
patent: 4424092 (1984-01-01), Salenz
patent: 4808059 (1989-02-01), Eddy
patent: 5407519 (1995-04-01), Joffe et al.
patent: 5564682 (1996-10-01), Tsuji
patent: 5645474 (1997-07-01), Kubo et al.
patent: 5667624 (1997-09-01), Akimoto et al.
patent: 5706843 (1998-01-01), Matsuo
patent: 5707051 (1998-01-01), Tsuji
patent: 5741558 (1998-04-01), Otani et al.
patent: 5766671 (1998-06-01), Matsui
patent: 5795430 (1998-08-01), Beeteson et al.
patent: 5902678 (1999-05-01), Konda et al.
patent: 5989346 (1999-11-01), Hiroki
patent: 6022185 (2000-02-01), Mokuo
patent: 6042689 (2000-03-01), Prester et al.
patent: 6222603 (2001-04-01), Sakai et al.
patent: 6231706 (2001-05-01), Higaki et al.
patent: 6245167 (2001-06-01), Stein
patent: 6254716 (2001-07-01), Russel et al.
patent: 6328838 (2001-12-01), Wirth et al.
patent: 6585471 (2003-07-01), Odajima et al.
patent: 6618937 (2003-09-01), Onitsuka
patent: 6631935 (2003-10-01), Casarotti et al.
patent: 6646689 (2003-11-01), Matsuda
patent: 6793756 (2004-09-01), Lee et al.
patent: 6798488 (2004-09-01), Murata et al.
patent: 6829032 (2004-12-01), Lee et al.
patent: 6953073 (2005-10-01), Lee et al.
patent: 6991699 (2006-01-01), Lee et al.
patent: 7096911 (2006-08-01), Hashizume et al.
patent: 7354494 (2008-04-01), Miyajima et al.
patent: 2002/0008838 (2002-01-01), Matsuda
patent: 2002/0036373 (2002-03-01), Kosakai
patent: 2002/0062787 (2002-05-01), Hashizume et al.
patent: 2003/0178150 (2003-09-01), Lee et al.
patent: 2003/0223030 (2003-12-01), Byun et al.
patent: 2004/0089415 (2004-05-01), Byun et al.
patent: 2004/0149379 (2004-08-01), Kobayashi et al.
patent: 2006/0027318 (2006-02-01), Hashizume et al.
patent: 2007/0034332 (2007-02-01), Muramoto et al.
patent: 62-211245 (1987-09-01), None
patent: 01-214042 (1989-08-01), None
patent: 05-190414 (1993-07-01), None
patent: 6-69315 (1994-03-01), None
patent: 07-058191 (1995-03-01), None
patent: 08-236597 (1996-09-01), None
patent: 08-316288 (1996-11-01), None
patent: 9-243982 (1997-09-01), None
patent: 9-246352 (1997-09-01), None
patent: 9-266242 (1997-10-01), None
patent: 10-156774 (1998-06-01), None
patent: 11-262828 (1999-09-01), None
patent: 2000-82732 (2000-03-01), None
patent: 2000-258746 (2000-09-01), None
patent: 2000-284295 (2000-10-01), None
patent: 2001-042341 (2001-02-01), None
patent: 2001-085494 (2001-03-01), None
patent: 2001-087719 (2001-04-01), None
patent: 2001-282126 (2001-10-01), None
patent: 2001-356353 (2001-12-01), None
patent: 2002-040398 (2002-02-01), None
patent: 2002-229044 (2002-08-01), None
patent: 2003-137616 (2003-05-01), None
patent: 2003-241202 (2003-08-01), None
patent: 10-2004-0010244 (2004-01-01), None
patent: 2004-102215 (2004-04-01), None
patent: 10-0272186 (1994-03-01), None
patent: 1998-041650 (1998-08-01), None
patent: 10-0272186 (2000-08-01), None
patent: 10-2001-0038101 (2001-05-01), None
patent: 00/11527 (2000-03-01), None
Office Action issued in corresponding Chinese Patent Application No. 200610099807.0, on Nov. 2, 2007.
Office Action issued in corresponding Chinese Patent Application No. 200610099803.2, on Nov. 2, 2007.
Japanese Office Action for corresponding application 2006-082407 mailed on Jan. 29, 2008.
Japanese Office Action for corresponding application 2005-371994 mailed on Jan. 29, 2008.
Japanese Office Action for corresponding application 2005-371993 mailed on Jan. 29, 2008.
U.S. Office Action for related U.S. Appl. No. 10/347,625; mailed Jun. 2, 2005.
U. S. Office Action for related U.S. Appl. No. 10/347,625; mailed Jan. 25, 2006.
U.S. Notice of Allowance for related U.S. Appl. No. 10/347,625; mailed Jul. 13, 2006.
U.S. Office Action for related U.S. Appl. No. 11/254,744; mailed Sep. 21, 2007.
U. S. Office Action for related U.S. Appl. No. 11/254,744; mailed Jun. 24, 2008.
U.S. Notice of Allowance for related U.S. Appl. No. 11/254,744; mailed Jun. 23, 2009.
U.S. Office Action for related U.S. Appl. No. 11/254,712; mailed Nov. 23, 2007.
U.S. Office Action for related U.S. Appl. No. 11/254,712; mailed Dec. 10, 2008.
U. S. Office Action for related U.S. Appl. No. 11/254,712; mailed Jul. 21, 2008.
U.S. Office Action for related U.S. Appl. No. 11/254,712; mailed Jun. 8, 2009.
U.S. Office Action for related U.S. Appl. No. 11/254,741; mailed Nov. 23, 2007.
U.S. Office Action for related U.S. Appl. No. 11/254,741; mailed Aug. 12, 2008.
U.S. Advisory Action for related U.S. Appl. No. 11/254,741; mailed Dec. 24, 2008.
U.S. Final Office Action for related U.S. Appl. No. 11/254,741; mailed Oct. 13, 2009.
Notice of Allowance for related U.S. Appl. No. 11/254,712; mailed Sep. 23, 2009.
Chinese Patent Office Action, mailed Oct. 19, 2007 and issued in corresponding Chinese Patent Application No. 200610099809.X.
Chinese Patent Office Action, mailed Oct. 19, 2007 and issued in corresponding Chinese Patent Application No. 200610099808.5.
Korean Office Action for corresponding Korean application 10-2008-0100401; dated Nov. 13, 2008.
Office Action for corresponding U.S. Appl. No. 11/254,741; mailed on Mar. 18, 2009.
English language Abstract of Korean Patent Publication No. 2001-0020690.
Korean Patent Office Action, mailed Aug. 1, 2007 and issued in related Korean Patent Application No. 10-2006-0040807.
Korean Patent Office Action, mailed Aug. 1, 2007 and issued in related Korean Patent Application No. 10-2006-0040806.
Korean Patent Office Action, mailed Aug. 1, 2007 and issued in related Korean Patent Application No. 10-2006-0040801.
Japanese Office Action for corresponding Japanese application 2005-150216; dated Oct. 25, 2005.
Notice of References Cited issued in related U.S. Appl. No. 11/254,744, mailed on Sep. 21, 2007.
U. S. Office Action issued on Nov. 23, 2007 for co-pending U.S. Appl. No. 11/254,712, filed Oct. 21, 2005.
U. S. Office Action issued on Nov. 23, 2007 for co-pending U.S. Appl. No. 11/254,741, filed Oct. 21, 2005.
U. S. Notice of Allowance for related U.S. Appl. No. 11/254,712; mailed Jan. 4, 2010.
U.S. Office Action for U.S. Appl. No. 10/935,240; mailed Mar. 1, 2005.
U.S. Office Action for U.S. Appl. No. 10/935,240; mailed Aug. 23, 2005.
U.S. Office Action for U.S. Appl. No. 10/935,240; mailed Feb. 10, 2006.
U.S. Office Action for U.S. Appl. No. 10/935,240; mailed Aug. 23, 2006.
U.S. Office Action for U.S. Appl. No. 10/935,240; mailed Apr. 3, 2007.
U.S. Notice of Allowance for U.S. Appl. No. 10/935,240; mailed Nov. 20, 2007.
U.S. Appl. No. 10/347,625, filed Sep. 22, 2003, Takanori Muramoto et al., Fujitsu Limited.
U.S. Appl. No. 11/254,744, filed Oct. 21, 2005, Takanori Muramoto et al., Fujitsu Limited.
U.S. Appl. No. 11/254,712, filed Oct. 21, 2005, Takanori Muramoto et al., Fujitsu Limited.
U.S. Appl. No. 11/254,741, filed Oct. 21, 2005, Takanori Muramoto et al., Fujitsu Limited.
U.S. Office Action for corresponding U.S. Appl. No. 11/254,741; mailed Apr. 26, 2011.
Adachi Tsukasa
Hashizume Koji
Kojima Takao
Miyajima Yosimasa
Muramoto Takanori
Crispino Richard
Fujitsu Limited
Schatz Christopher
Staas & Halsey , LLP
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