Apparatus and method for enlarging metal line pitch of semicondu

Details Apparatus and method for enlarging metal line pitch of semicondu Apparatus and method for enlarging metal line pitch of semicondu

1997-11-07

1999-07-13

Nelms, David

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36523001, G11C 800

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059236078

ABSTRACT:
An apparatus and a method for enlarging a metal line pitch of a semiconductor memory device. The metal line enlargement apparatus comprises a first transfer circuit for transferring data amplified by bit line sense amplifiers to data bus lines in response to an output signal from a column decoder, and a second transfer circuit for transferring the data amplified by the bit line sense amplifiers to the first transfer circuit in response to first and second bit line sense amplifier group selection signals which are generated by decoding a column address. According to the present invention, the bit line sense amplifiers are effectively connected to the data bus lines to increase layout and output line pitches of the column decoder. Therefore, a design margin in a cell core region can be secured and a difficulty in a metal process can be reduced.

REFERENCES:
patent: 5297090 (1994-03-01), McClure
patent: 5539700 (1996-07-01), Kawahara et al.
patent: 5594704 (1997-01-01), Konishi et al.
patent: 5717645 (1998-02-01), Kengeri et al.
patent: 5748547 (1998-05-01), Shau

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