Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2006-09-19
2006-09-19
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
C257S782000
Reexamination Certificate
active
07109587
ABSTRACT:
An apparatus and method for an enhanced thermally conductive package for high powered semiconductor devices. The package includes a semiconductor die having an active surface and a non-active surface and a metal layer formed on the non-active surface of the die. The package is intended to be mounted onto a metal pad provided on a printed circuit board. A solder is used to affix the metal layer on the non-active surface of the die to the metal pad of the printed circuit board. The interface between the die and the printed circuit board thus includes just three metal layers, including the non-active surface of the die, the solder, and the metal pad on the printed circuit board. The reduced number of metal layers improves heat dissipation and thermal conductivity of the package.
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Co-Pending U.S. Appl. No. 10/861,166, entitled “Lead Configuration For Inline Packages,” by Felix C. Li, filed Jun. 3, 2004. (Not enclosed per “Waiver of the Copy Requirement in 37 CFR 1.98 for Cited Pending U.S. Patent Applications,” USPTO Office Gazette, Sep. 21, 2004.)
Beyer Weaver & Thomas LLP
Clark S. V.
National Semiconductor Corporation
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