Apparatus and method for enabling hot plugging of an integrated

Details Apparatus and method for enabling hot plugging of an integrated Apparatus and method for enabling hot plugging of an integrated

1999-03-02

2000-11-21

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361704, 361707, 361710, 361714, 257706, 257722, 174 163, 165 803, 16510433, 165185, H05K 720

Patent

active

061512176

ABSTRACT:
An apparatus for handling an electrical component, such as a CPU module, having a heatsink mounted to an upper surface and a plurality of contact pins is disclosed. The apparatus has a base plate with a central opening, a pair of parallel end plates extending upward from the base plate, and a top plate with a pair of integral air baffles. A set of fasteners are used to mount and retain the component/heatsink assembly within the apparatus. The air baffles are used to deflect air flow through the heatsink. The apparatus also has a handle on the top plate and a guide post on each corner of the bottom plate for handling and pin protection. The component/heatsi&k assembly is mounted in the apparatus before the top plate is attached such that the pins of the component extend through the opening in the base plate. When the assembly is aligned within the apparatus, the fasteners secure the assembly from movement relative to the apparatus. The apparatus/component assembly is then mounted onto a mating socket by aligning the guide posts with holes in the socket. The assembly is pressed into the socket until the pins seat in the socket holes. The apparatus is left installed with the component.

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patent: 5946191 (1999-08-01), Oyamada
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