Apparatus and method for embedding conductors in a non-planar su

Details Apparatus and method for embedding conductors in a non-planar su Apparatus and method for embedding conductors in a non-planar su

1997-03-31

1998-07-21

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 731, 156298, 1563031, 156538, 1565801, B32B 3116

Patent

active

057830088

ABSTRACT:
An apparatus and a method for embedding conductors in a structure having a signal distribution function associated therewith such as a vehicle instrument panel are disclosed. The apparatus includes an embedding tool which can be positioned in three dimensional space to embed conductors in non-planar surfaces. A method for such embedding is also disclosed.

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