Apparatus and method for electroplating wafers

Details Apparatus and method for electroplating wafers Apparatus and method for electroplating wafers

1992-04-21

1993-07-20

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204297W, C25D 1700

Patent

active

052289672

ABSTRACT:
An apparatus and corresponding method for electroplating wafers includes supporting a plurality of wafers on a backing board in the electroplating tank such that one surface of each wafer is masked from the electrolytic reaction. A programmable controller is used to regulate the waveform, frequency and duration of current passing between each individual wafer and a corresponding anode electrode during the electroplating process. Voltage is monitored between the wafers and the anode electrodes to ensure a proper electrical connection is maintained with each individual wafer during the electroplating process.

REFERENCES:
patent: 5024746 (1991-06-01), Stierman

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