Apparatus and method for electroplating wafers

Details Apparatus and method for electroplating wafers Apparatus and method for electroplating wafers

1992-12-09

1993-12-28

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205122, C25D 502

Patent

active

052736423

ABSTRACT:
An apparatus and corresponding method for electroplating wafers includes supporting a plurality of wafers on a backing board in the electroplating tank such that one surface of each wafer is masked from the electrolytic reaction. A programmable controller is used to regulate the waveform, frequency and duration of current passing between each individual wafer and a corresponding anode electrode during the electroplating process. Voltage is monitored between the wafers and the anode electrodes to ensure a proper electrical connection is maintained with each individual wafer during the electroplating process.

REFERENCES:
patent: 5024746 (1991-06-01), Stierman

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