Apparatus and method for electroplating pin grid array packaging

Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Electrical product

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205123, 205125, 204224R, 204297R, 204297W, C25D 712, C25D 1706, C25D 2100

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active

055164161

ABSTRACT:
An apparatus and a method for electroplating pin grid array (PGA) packaging modules by utilizing a compressible member and an electrically conductive foil for providing electrical connections to the pins such that all the critical areas of the pins, the wire bond pads, the seal band and the die cavity are electroplated simultaneously through the connection to the pins.

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