Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Reexamination Certificate
2011-05-17
2011-05-17
Smith, Matthew S (Department: 2823)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to nonconductive state
C438S382000, C438S601000, C257SE21592
Reexamination Certificate
active
07943437
ABSTRACT:
Method of making an electronic fuse blow resistor structure. In one embodiment, the method includes forming an insulator film, depositing a conductor on the insulator film, and after the depositing, etching the conductor to form a plurality of spaced apart non-conductive regions and a plurality of spaced-apart conductive regions. In another embodiment, the method includes forming the insulator film, forming a conductive sheet, and sub-dividing the conductive sheet into the plurality of conductive regions.
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W.J. Craig, et al., “On-Chip Electrically Programmable Fuse”, IBM Technical Disclosure Bulletin, vol. 29, No. 3, Aug. 1986.
Canale Anthony
International Business Machines - Corporation
Jefferson Quovaunda
Roberts Mlotkowski Safran & Cole P.C.
Smith Matthew S
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