Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate
2005-08-23
2005-08-23
Ryan, Patrick Joseph (Department: 1745)
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C204S267000
Reexamination Certificate
active
06932892
ABSTRACT:
A process for applying a metallization interconnect as to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin seed layer having a thickness of less than or equal to about 500 Angstroms. The ultra-thin seed layer is then enhanced by depositing additional metal thereon to provide an enhanced sed layer. The enhanced seed layer has a thickness at all points on sidewalls of substantially all recessed features distributed within the workpiece that is equal to or greater than about 10% of the nominal seed layer thickness over an exteriorly disposed surface of the workpiece.
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Chen Linlin
Taylor Thomas
Parsons Thomas H.
Perkins Coie LLP
Ryan Patrick Joseph
Semitool Inc.
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