Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming multiple superposed electrolytic coatings
Reexamination Certificate
2005-07-19
2005-07-19
Ryan, Patrick (Department: 1745)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Forming multiple superposed electrolytic coatings
C205S123000, C205S157000, C205S221000, C205S295000, C204S22400M
Reexamination Certificate
active
06919013
ABSTRACT:
A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin seed layer having a thickness of less than or equal to about 500 Angstroms. The ultra-thin seed layer is then enhanced by depositing additional metal thereon to provide an enhanced seed layer. The enhanced seed layer has a thickness at all points on sidewalls of substantially all recessed features distributed within the workpiece that is equal to or greater than about 10% of the nominal seed layer thickness over an exteriorly disposed surface of the workpiece.
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Parsons Thomas H.
Perkins Coie LLP
Ryan Patrick
Semitool Inc.
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