Coating apparatus – Control means responsive to a randomly occurring sensed...
Reexamination Certificate
2005-11-22
2005-11-22
Edwards, Laura (Department: 1734)
Coating apparatus
Control means responsive to a randomly occurring sensed...
C118S684000, C118S696000, C118S699000, C118S050000, C034S092000, C034S403000, C034S406000
Reexamination Certificate
active
06966949
ABSTRACT:
In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.
REFERENCES:
patent: 6151796 (2000-11-01), Karamatsu et al.
patent: 6190459 (2001-02-01), Takeshita et al.
patent: 6222161 (2001-04-01), Shirakawa et al.
patent: 6261007 (2001-07-01), Takamori et al.
patent: 6364953 (2002-04-01), Kawakami et al.
patent: 6443641 (2002-09-01), Takamori et al.
patent: 6473995 (2002-11-01), Miyakawa et al.
Kitano Takahiro
Kobayashi Shinji
Sugimoto Shinichi
Edwards Laura
Tokyo Electron Limited
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