Drying and gas or vapor contact with solids – Process – Gas or vapor contact with treated material
Patent
1997-02-28
1999-08-24
Bennett, Henry A.
Drying and gas or vapor contact with solids
Process
Gas or vapor contact with treated material
34 78, F26B 300
Patent
active
059409851
ABSTRACT:
A substrate drying device including a process chamber, a transferring device for transferring a substrate to/from the process chamber, a solvent vapor generating chamber having a container for receiving liquid organic solvent and a heater for heating the liquid organic solvent of the container to generate vapor of the organic solvent, a solvent supply unit for supplying the liquid organic solvent in the container, a first passage, communicating with the solvent vapor generating chamber and the process chamber, for passing vapor of the organic solvent, a second passage, communicating with the container of the solvent vapor generating chamber and the solvent supply unit, for passing liquid organic solvent, a flow rate controller for controlling flow rate of the liquid organic solvent to be supplied to the solvent vapor generating chamber from the solvent supply unit, and a control device for detecting a state of organic solvent of at least one of the solvent supply unit, the solvent vapor generating chamber, and the process chamber to control an operation of the flow rate controller based on the detected state of organic solvent.
REFERENCES:
patent: 5369891 (1994-12-01), Kamikawa
patent: 5371950 (1994-12-01), Schumacher
patent: 5443540 (1995-08-01), Kamikawa
Kamikawa Yuji
Ueno Kinya
Bennett Henry A.
Tokyo Electron Limited
Wilson Pamela A.
LandOfFree
Apparatus and method for drying substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for drying substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for drying substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-456240