Apparatus and method for drying semiconductor substrate

Details Apparatus and method for drying semiconductor substrate Apparatus and method for drying semiconductor substrate

1999-05-04

2000-12-12

Gravini, Stephen

Drying and gas or vapor contact with solids

Apparatus

With means to treat gas or vapor

34 77, 34 78, 134 254, 134902, F26B 2100

Patent

active

061581410

ABSTRACT:
An apparatus and method for drying semiconductor substrates to dry about 50 semiconductor wafers by evaporating an organic solvent and blowing the evaporated organic solvent onto these semiconductor wafers through a nozzle, comprises the evaporate organic solvent being blown onto the semiconductor wafers from a direction aslant by an angle from 20.degree. to 50.degree. from a vertical direction toward the semiconductor wafers. At this time, the initial spray amount of the evaporated organic solvent is not less than 0.8 cc/second and not more than 1.5 cc/second, additionally, the amount of the organic solvent used for drying is not less than 70 cc/batch and not more than 200 cc/batch.

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patent: 5985041 (1999-11-01), Florez
patent: 6029371 (2000-02-01), Kamikawa

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