Apparatus and method for double-sided polishing semiconductor wa

Details Apparatus and method for double-sided polishing semiconductor wa Apparatus and method for double-sided polishing semiconductor wa

1996-11-14

1999-06-22

Utech, Benjamin

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

156345, C23F 102, H01L 21302

Patent

active

059140534

ABSTRACT:
In double-side polishing of semiconductor wafers, not only the two main surfaces but also the surface of the edge portion can be polished in one operation with cost reduction and freedom from contamination. An apparatus with twin polishing turn tables is used in the double-side polishing and the inner peripheral edge of each carrier hole formed in a wafer carrier is profiled such that the sectional profile of the inner peripheral edge is substantially the copy of the edge of the wafer placed in the hole.

REFERENCES:
patent: 4588473 (1986-05-01), Hisatomi et al.
patent: 5110764 (1992-05-01), Ogino
patent: 5316620 (1994-05-01), Hasegawa et al.
J. Haisma et al., "Improved Geometry of Double-Sided Polished Parallel Wafers Prepared for Direct Wafer Bonding", Applied Optics, vol. 33, No. 34, Dec. 1, 1994, pp. 7945-7954.

Affiliated with

Also associated with

Rating

Apparatus and method for double-sided polishing semiconductor wa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for double-sided polishing semiconductor wa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for double-sided polishing semiconductor wa will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1706473