Apparatus and method for dissipating heat from a core module ass

Details Apparatus and method for dissipating heat from a core module ass Apparatus and method for dissipating heat from a core module ass

1998-04-30

1999-11-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361688, 361690, 361704, 361709, 361713, 361719, 165 802, 165 803, 454184, H05K 720

Patent

active

059782250

ABSTRACT:
A core module assembly of a retail terminal includes a microprocessor which performs computing functions associated with operation of the retail terminal, whereby heat is generated by the microprocessor during performance of the computing functions. The core module assembly further includes a first heat transfer structure positioned in thermal communication with the microprocessor. The first heat transfer structure has a body portion and a key portion extending from the body portion. The core module assembly also includes a second heat transfer structure having a keying slot defined therein. Relative movement between the first heat transfer structure and the second heat transfer structure is limited when the key portion of the first heat transfer structure is positioned within the keying slot of the second heat transfer structure. The core module assembly includes a fastener for maintaining the key portion of the first heat transfer structure within the keying slot of the second heat transfer structure.

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