Apparatus and method for die bonding semiconductor element

Details Apparatus and method for die bonding semiconductor element Apparatus and method for die bonding semiconductor element

1994-04-22

1996-01-02

Walberg, Teresa J.

Electric heating

Metal heating

By arc

21912164, B23K 2602

Patent

active

054810825

ABSTRACT:
An apparatus for die bonding a semiconductor element to a submount with a soldering material includes a laser light source emitting laser light of a wavelength transmitting through the submount and a means for introducing the laser light emitted from the laser light source to a prescribed position and radiating the laser light to a required part of the submount. A method for die bonding a semiconductor element to a submount, includes placing a soldering material on the submount and placing the semiconductor element on the soldering material, radiating laser light of a wavelength transmitting through the submount from the rear surface side of the submount toward the soldering material so as to heat and melt the soldering material, and thereby bonding the semiconductor element to the submount. Thus, the die bonding is performed in a short time while observing the characteristic of the semiconductor element, so that deformation of the element or deterioration of the element characteristic during the die bonding is prevented even when the semiconductor element is subjected to a high temperature for a long time during the die bonding.

REFERENCES:
patent: 4404453 (1983-09-01), Gotman
patent: 4424435 (1984-01-01), Barnes, Jr.
patent: 4733039 (1988-03-01), Schnable et al.
patent: 5010036 (1991-04-01), Calviello et al.
patent: 5122635 (1992-06-01), Knodler et al.
patent: 5357122 (1994-10-01), Okubora et al.
R. L. Melcher, "Laser-Welded Package for Semiconductor and Superconductor Electronics", IBM Technical Disclosure Bulletin, vol. 22, No. 2, Jul. 1979, p. 834.
Zum Titelbild, "Mehrfachloten mit dem Laserstrahl", vol. 47, No. 21, 1975 Munchen, p. 6.

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