Apparatus and method for dicing semiconductor wafers

Details Apparatus and method for dicing semiconductor wafers Apparatus and method for dicing semiconductor wafers

2005-08-23

2005-08-23

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S462000, C438S460000, C438S459000

Reexamination Certificate

active

06933212

ABSTRACT:
A method and apparatus for the dicing of semiconductor wafers using pressure to mechanically separate the individual die from the wafer without the use of a wafer saw. The method includes forming trenches along the scribe lines on a semiconductor wafer and then applying a mechanical pressure to the semiconductor wafer. The mechanical pressure causes a “clean break” of the wafer along the scribe lines, thereby singulating individual die on the wafer. The apparatus comprises a pad for supporting a semiconductor wafer and a positioning member to position the semiconductor wafer on the pad. A pressure mechanism is provided to apply a mechanical pressure to the wafer so as to singulate the individual die on the wafer.

REFERENCES:
patent: 6075280 (2000-06-01), Yung et al.
patent: 6121118 (2000-09-01), Jin et al.
patent: 6162703 (2000-12-01), Muntifering et al.
patent: 6184109 (2001-02-01), Sasaki et al.
patent: 6583032 (2003-06-01), Ishikawa et al.

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