Apparatus and method for dicing semiconductor wafers

Details Apparatus and method for dicing semiconductor wafers Apparatus and method for dicing semiconductor wafers

1996-09-10

1998-06-23

Rachuba, Maurina T.

Severing by tearing or breaking

Breaking or tearing apparatus

Combined with preliminary weakener or with nonbreaking cutter

225103, B26F 300

Patent

active

057692971

ABSTRACT:
A wafer to be diced to form chips is placed on the sticky side of a thin elastic film in the form of a Swiss Cross which is secured to the side members of a compressed but expandable square frame, the frame being placed in a scribing and dicing machine in its released state so that the frame and thus the film can expand during the dicing operation, further expansion being accomplished after dicing of the wafer by heating the film while in an expansion fixture to insure removal of the chips from the film without damaging adjacent chips. The sticky material on the film may be rendered less sticky after formation of the chips by exposure to ultraviolet energy or the like.

REFERENCES:
patent: 3567986 (1971-03-01), Wark et al.
patent: 3657791 (1972-04-01), Hobbs
patent: 4018372 (1977-04-01), Insolio
patent: 4109841 (1978-08-01), DeTorre
patent: 4545515 (1985-10-01), Kozyrski
patent: 4653680 (1987-03-01), Regan

Affiliated with

Also associated with

Rating

Apparatus and method for dicing semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for dicing semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for dicing semiconductor wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1387117