Apparatus and method for detecting missing interconnect material

Details Apparatus and method for detecting missing interconnect material Apparatus and method for detecting missing interconnect material

1991-07-15

1992-09-22

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228103, H01L 21603

Patent

active

051489678

ABSTRACT:
Apparatus and method for detecting missing interconnect material. The distance traveled by a bonding tool is measured while the interconnect material is being bonded to a site. Unless it exceeds a predetermined threshold, a signal is generated indicating missing interconnect material. A pivoting system associated mating electrical contacts, and a measurement/comparator are advantageously employed to facilitate this measurement.

REFERENCES:
patent: 4109846 (1978-08-01), Pennings et al.
patent: 4718591 (1988-01-01), Hill
patent: 5046655 (1991-09-01), Ohashi et al.
patent: 5060841 (1991-10-01), Oshima et al.

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