Apparatus and method for detecting defects on silicon dies on a

Details Apparatus and method for detecting defects on silicon dies on a Apparatus and method for detecting defects on silicon dies on a

1997-09-04

1999-08-24

Picardat, Kevin M.

Semiconductor device manufacturing: process

With measuring or testing

438 16, 438460, G01R 3126, H01L 2166

Patent

active

059435518

ABSTRACT:
An apparatus and method for detecting defects on silicon dies on a silicon wafer (16) comprising an image acquisition system (10) and a computer (32) that determines a statistical die model by analyzing a random selection of dies (42) within a die matrix (37) and compares the statistical die model to matrices of silicon dies (38) to determine which silicon dies (38) have surface defects, is disclosed.

REFERENCES:
patent: 5633173 (1997-05-01), Bae
patent: 5643404 (1997-07-01), Muraoka et al.
patent: 5665609 (1997-09-01), Mori
patent: 5744381 (1998-04-01), Tabata et al.

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