Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Patent
1997-05-16
2000-03-07
Utech, Benjamin L.
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
156345, 216 90, 134 13, H01L 21302, C23F 102, B08B 600
Patent
active
060339942
ABSTRACT:
An improved method of deprocessing semiconductor chips provides faster, more accurate and more complete deprocessing. The chip to be deprocessed is placed in a chemical agent to loosen or undercut layers of material to be removed. A physical impact or series of impacts is then delivered to the chip, for example, by a compression wave transmitted through a fluid medium. The impact will cause chemically loosened or undercut material to break loose from the chip. The amount of time between when the chip is placed in the chemical agent and when the impact occurs, and the power and duration of the impact can be controlled to determine what layer of the chip structure will be exposed by the deprocessing.
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Goudreau George
Kananen Ronald P.
Sony Corporation
Sony Electronics Inc.
Utech Benjamin L.
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