Apparatus and method for depositing and reflowing solder...

Details Apparatus and method for depositing and reflowing solder... Apparatus and method for depositing and reflowing solder...

2008-03-25

2008-03-25

Stoner, Kiley (Department: 1793)

Metal fusion bonding

With control means responsive to sensed condition

Work-responsive

C228S022000, C228S248100

Reexamination Certificate

active

07347348

ABSTRACT:
Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stencil having a plurality of apertures at least proximate to the workpiece. The method further includes placing discrete masses of solder paste into the apertures and reflowing the discrete masses of solder paste while the stencil is positioned at least proximate to the workpiece and while the discrete masses are in the apertures. In another embodiment of the invention, a stenciling machine for depositing and reflowing solder paste on the microelectronic workpiece includes a heater for reflowing the solder paste, a stencil having a plurality of apertures, and a controller operatively coupled to the heater and the stencil. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.

REFERENCES:
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5539153 (1996-07-01), Schwiebert et al.
patent: 5593927 (1997-01-01), Farnworth et al.
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5782399 (1998-07-01), Lapastora
patent: 5851845 (1998-12-01), Wood et al.
patent: 5891797 (1999-04-01), Farrar
patent: 5921462 (1999-07-01), Gordon
patent: 5933713 (1999-08-01), Farnworth
patent: 5946553 (1999-08-01), Wood et al.
patent: 5986209 (1999-11-01), Tandy
patent: 5988487 (1999-11-01), MacKay et al.
patent: 5990566 (1999-11-01), Farnworth et al.
patent: 6004867 (1999-12-01), Kim et al.
patent: 6008070 (1999-12-01), Farnworth
patent: 6011314 (2000-01-01), Leibovitz et al.
patent: 6018249 (2000-01-01), Akram et al.
patent: 6020624 (2000-02-01), Wood et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6072236 (2000-06-01), Akram et al.
patent: 6081429 (2000-06-01), Barrett
patent: 6089920 (2000-07-01), Farnworth et al.
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6107122 (2000-08-01), Wood et al.
patent: 6112975 (2000-09-01), Lapastora
patent: 6124634 (2000-09-01), Akram et al.
patent: 6126059 (2000-10-01), MacKay et al.
patent: 6130474 (2000-10-01), Corisis
patent: 6148509 (2000-11-01), Schoenfeld et al.
patent: 6150717 (2000-11-01), Wood et al.
patent: 6173887 (2001-01-01), Mead et al.
patent: 6184465 (2001-02-01), Corisis
patent: 6187615 (2001-02-01), Kim et al.
patent: 6188232 (2001-02-01), Akram et al.
patent: 6201304 (2001-03-01), Moden
patent: 6214716 (2001-04-01), Akram
patent: 6225689 (2001-05-01), Moden et al.
patent: 6228687 (2001-05-01), Akram et al.
patent: 6232666 (2001-05-01), Corisis et al.
patent: 6235552 (2001-05-01), Kwon et al.
patent: 6239489 (2001-05-01), Jiang
patent: 6247629 (2001-06-01), Jacobson et al.
patent: 6258623 (2001-07-01), Moden et al.
patent: 6265766 (2001-07-01), Moden
patent: 6281042 (2001-08-01), Ahn et al.
patent: 6285204 (2001-09-01), Farnworth
patent: 6310390 (2001-10-01), Moden
patent: 6326697 (2001-12-01), Farnworth
patent: 6326698 (2001-12-01), Akram
patent: 6329222 (2001-12-01), Corisis et al.
patent: 6331221 (2001-12-01), Cobbley
patent: 6344401 (2002-02-01), Lam
patent: 6407381 (2002-06-01), Glenn et al.
patent: 6503780 (2003-01-01), Glenn et al.
patent: 6523736 (2003-02-01), Farnworth
patent: 6577008 (2003-06-01), Lam et al.
patent: 6642485 (2003-11-01), Goenka et al.
patent: 6664176 (2003-12-01), Hedler et al.
patent: 6845901 (2005-01-01), Koopmans
patent: 2003/0088974 (2003-05-01), Nakamura et al.
patent: 2003/0167633 (2003-09-01), Rutiser
patent: 2003/0176014 (2003-09-01), Hofmann
patent: 2003/0207574 (2003-11-01), Aiba et al.
patent: 2003/0218261 (2003-11-01), Capote et al.
patent: 2004/0110366 (2004-06-01), MacKay et al.

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