Apparatus and method for decomposition of chemical compounds usi

Hazardous or toxic waste destruction or containment – Containment – Solidification – vitrification – or cementation

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422211, 422239, C10B 1700, B01J 802

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active

058116311

ABSTRACT:
An apparatus for and method of decomposing a chemical compound, which may be an environmentally undesirable material, is accomplished by impinging a flow of the chemical compound on a heated member. Various embodiments are possible, including having the member have a plurality of openings, having the member be configured to direct the flow of the chemical compound in a particular direction, and having the member be self supported on the wall of the reaction chamber.

REFERENCES:
patent: 3625846 (1971-12-01), Murdoch et al.
patent: 3723290 (1973-03-01), Hamblyn et al.
patent: 3933608 (1976-01-01), Haas et al.
patent: 3979503 (1976-09-01), Koartien
patent: 4386258 (1983-05-01), Akashi et al.
patent: 4438706 (1984-03-01), Boday et al.
patent: 4509434 (1985-04-01), Boday et al.
patent: 4644877 (1987-02-01), Barton
patent: 4657738 (1987-04-01), Kanter et al.
patent: 4695448 (1987-09-01), Anthony
patent: 4759300 (1988-07-01), Hansen et al.
patent: 4766287 (1988-08-01), Morrisroe et al.
patent: 4833294 (1989-05-01), Montaser et al.
patent: 4926021 (1990-05-01), Streusand et al.
patent: 4985219 (1991-01-01), Helfritch et al.
patent: 5026464 (1991-06-01), Mizuno et al.
patent: 5110579 (1992-05-01), Anthony et al.
patent: 5131941 (1992-07-01), Lemelson
patent: 5187344 (1993-02-01), Mizuno et al.
patent: 5213758 (1993-05-01), Kawashima et al.
patent: 5230931 (1993-07-01), Yamazaki et al.
patent: 5266548 (1993-11-01), Koradia et al.
patent: 5290392 (1994-03-01), Lau et al.
patent: 5322567 (1994-06-01), Deaton et al.
H. Sawin, "Alternative Chemistries for Dry Etching", presentation give Feb. 15-16, 1994, Austin, Texas.
Sugano et al., "Microwave Plasma Etching", Application of Plasma Process to VLSI Technology, 1985, 1985, pp. 142-157, (no month).
F.W. Breitbarth et al., "Fluorocarbon Conversion in a Hetergenous Low-Pressure Plasma Reaction--A Gas-Phase FT-IR Study," 11th International Symposium on Plasma Chemistry, pp. 728-733, (no date).
H.J. Tiller et al., "Toxic Products by Plasma Process using Fluorocarbons," 11th International Symposium on Plasma Chemistry, pp. 698-703, (no date).
Herbert H. Sawin, "Challenges in dry etching: uniformity, selectivity, pattern dependencies, damage, and cleaning," Microelectronics Engineering 23 (1994), pp. 15-21 (no month).
Sugano et al., "Damage by Plasma Etching", Application of Plasma Process to VLSI Technology, 1985, 1985, pp. 298-311, (no month).

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